IP Library › Patent Application 60332016
Patent Application Provisional
App. No. 60/332,016 · Confirmation No. 2002

Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing

Provisional Application Expired
⬇ PDF
 Code Description Pages PDF
2001-11-21 TRNA Transmittal of New Application 2 View
2001-11-21 SPEC Specification 9 View
2001-11-21 ABST Abstract 1 View
2001-11-21 DRW Drawings-only black and white line drawings 5 View
2001-11-21 LET. Miscellaneous Incoming Letter 1 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
App. No.
60/332,016
Filed
2001-11-21