Patent Assignment
Reel/Frame 014520/0672
Assignment of Assignor's Interest
Recorded: 2004-04-14
Pages: 4
Assignors
ZHAO, YAN
Executed: 2004-04-02
YEH, CHANG-CHUN
Executed: 2004-04-02
CHEN, ZHONGWEI
Executed: 2004-04-02
JAU, JACK
Executed: 2004-04-02
Assignee
HERMES-MICROVISION, INC.
1595 MCCANDLESS DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Method for in-line monitoring of via/contact holes etch process based on test structures in semiconductor wafer manufacturing
Application:
60/332,016 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 19, 2004
From: CHEN, ZHONG WEI
To: HERMES-MICROVISION (TAIWAN) INC.
Reel/Frame 015225/0702 →
Corrective Coversheet to Correct the Assignor Previously Recorded on Reel 015225, Frame 0702.
Nov 10, 2004
From: HERMES-MICROVISION, INC.
To: HERMES-MICROVISION (TAIWAN) INC.
Reel/Frame 015381/0028 →
Assignment of Assignor's Interest
Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest
Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →