IP Library Granted Patent US 8,606,017
Granted Patent B1
US 8,606,017 · App. 13/073,161 · Granted Dec 10, 2013

Method for inspecting localized image and system thereof

Inventors: Wei Fang (Milpitas, CA); Jack Jau (Los Altos Hills, CA); Zhao-Li Zhang (San Jose, CA)
Assignee: Hermes Microvision, Inc.
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Quick Facts
Patent No.
US 8,606,017
App. No.
13/073,161
Granted
Dec 10, 2013
Kind
B1
Abstract

A plurality of points with identical geometric feature is compared with their SEM characteristic features to inspect defect in a localized image. Original design information is included in the geometric feature such that absolute compare can be performed in this inspection method. Further, this method can also be applied to the localized image with or without repeated or redundant pattern.

Claims (72)

1. A method for determining by a computing device an inconsistency in an image, wherein the image is translated from a vector pattern and the method comprises steps of:

aligning the image to the vector pattern including an original design of the image;

quantizing the vector pattern into a plurality of first points;

calculating geometric features of the plurality of first points;

identifying from the image a plurality of second points corresponding to the plurality of first points;

comparing measurement values of second points with identical geometric features; and

determining the inconsistency in the image based on said step of comparing.

2. The method for determining an inconsistency in an image according to claim 1 , wherein the vector pattern comprises geometric polygons.

3. The method for determining an inconsistency in an image according to claim 1 , wherein the geometric features comprises angle between lines from a point to another two points, phase of a point with respect to another point, direction relationship from a point to another few points or any combination thereof.

4. The method for determining an inconsistency in an image according to claim 3 , wherein the measurement values comprises a gray feature.

5. The method for determining an inconsistency in an image according to claim 4 , wherein the image comprises a scanned image by using scanning electron microscope (SEM), or a captured image by using optical detection means.

6. The method for determining an inconsistency in an image according to claim 5 , wherein the image comprises a scanning electron microscope (SEM) image.

7. The method for determining an inconsistency in an image according to claim 5 , wherein the image comprises a SEM image of a semiconductor element or mask.

8. A non-transitory computer readable medium encoded with a computer program implementing a method for determining an inconsistency in an image, wherein the image is translated from a vector pattern and the method comprises steps of:

aligning the image to the vector pattern including an original design of the image;

quantizing the vector pattern into a plurality of first points;

calculating geometric features of the plurality of first points;

identifying from the image a plurality of second points corresponding to the plurality of first points;

comparing measurement values of second points with identical geometric features; and

determining the inconsistency in the image based on said step of comparing.

9. The computer readable medium according to claim 8 , wherein the vector pattern comprises geometric polygons.

10. The computer readable medium according to claim 8 , wherein the geometric features comprises angle between lines from a point to another two points, phase, phase of a point with respect to another point, direction relationship from a point to another few points or any combination thereof.

11. The computer readable medium according to claim 9 , wherein the measurement values comprises a gray feature.

12. The computer readable medium according to claim 11 , wherein the image comprises a scanned image by using scanning electron microscope (SEM), or a captured image by using optical detection means.

13. The computer readable medium according to claim 12 , wherein the image comprises a scanning electron microscope (SEM) image.

14. The computer readable medium according to claim 12 , wherein the image comprises an SEM image of a semiconductor element or mask.

15. A charged particle beam inspection system, comprising:

a charged particle beam probe generator for generating a charged particle beam probe;

a charged particle beam deflection module for scanning the charged particle beam probe across a surface of a sample;

an image forming apparatus for detecting secondary charged particles emitted from the sample being bombarded by the charged particle beam probe and forming at least one charged particle microscopic image of the sample accordingly; and

an inconsistency determination module being coupled with the image forming apparatus and encoded with a computer program implementing a method for determining an inconsistency in an image, wherein the image is translated from a vector pattern and the method comprises steps of:

aligning the image to the vector pattern including an original design of the image;

quantizing the vector pattern into a plurality of first points;

calculating geometric features of the plurality of first points;

identifying from the image a plurality of second points corresponding to the plurality of first points;

comparing measurement values of second points with identical geometric features; and

determining the inconsistency in the image based on said step of comparing.

16. The charged particle beam inspection system according to claim 15 , wherein the vector pattern comprises geometric polygons.

17. The charged particle beam inspection system according to claim 15 , wherein the geometric features comprises included angle between lines from a point to another two points, phase of a point with respect to another point, direction relationship from a point to another few points or any combination thereof.

18. The charged particle beam inspection system according to claim 16 , wherein the measurement values comprises a gray feature.

19. The charged particle beam inspection system according to claim 18 , wherein the image comprises a scanned image by using scanning electron microscope (SEM), or a captured image by using optical detection means.

20. The charged particle beam inspection system according to claim 19 , wherein the image comprises a scanning electron microscope (SEM) image.

21. The charged particle beam inspection system according to claim 19 , wherein the image comprises an SEM image of a semiconductor element or mask.

22. A method for comparing points in an image within a computing device to determine an inconsistency, wherein the image is composed of individual pixels each with its own grey level and is translated from a vector pattern, the method comprising steps of:

aligning the image to the vector pattern including an original design of the image;

quantizing the vector figure into a plurality of first points;

calculating geometric features of the plurality of first points;

identifying from the image a plurality of second points corresponding to the plurality of first points;

comparing grey level characteristics of second points with identical geometric features; and

determining the inconsistency in the image based on said step of comparing.

23. A method for detecting a defect on a SEM image, comprising steps of:

aligning the SEM image to a vector pattern of a corresponding original design;

quantizing geometric polygons of the vector pattern into a plurality of first points;

calculating geometric features of the plurality of first points;

identifying from the SEM image a plurality of second points corresponding to the plurality of first points;

comparing measurement values of second points with identical geometric features; and

determining the defect in the image based on said step of comparing.

24. A method for inspecting an SEM image of a mask, the method comprising steps of:

aligning the SEM image to a vector pattern of a corresponding original design;

quantizing geometric polygons of the vector pattern into a plurality of first points;

calculating geometric features of the plurality of first points;

identifying from the SEM image a plurality of second points corresponding to the plurality of first points; and

comparing measurement values of second points with identical geometric features; and

inspecting the SEM image based on said step of comparing.

25. An apparatus for detecting a defect on an image, comprising:

means for aligning the image to a vector pattern of a corresponding original design;

means for quantizing geometric polygons of the vector pattern into a plurality of first points;

means for calculating geometric features of the plurality of first points;

means for identifying from the image a plurality of second points corresponding to the plurality of first points; and

means for comparing measurement values of second points with identical geometric features; and

means for determining the defect in the image based on said means for comparing.

26. An apparatus for detecting a defect on an image according to claim 25 , wherein the image comprises a scanned image by using scanning electron microscope (SEM), or a captured image by using optical detection means.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2011
From: FANG, WEI; ZHANG, ZHAO-LI; JAU, JACK
To: HERMES MICROVISION, INC.
Reel/Frame 026031/0901 →
Continuity (1)
Continuation 12644736 · Dec 22, 2009