Patent Assignment
Reel/Frame 022846/0087
Assignment of Assignor's Interest
Recorded: 2009-06-18
Pages: 2
Assignor
HERMES-MICROVISION, INC.
Executed: 2004-04-05
Assignee
HERMES-MICROVISION (TAIWAN) INC.
18 CREATION ROAD, 1 SCIENCE PARK, HSIN-CHU, TAIWAN
Covered Property
(1)
Method for in-Line Monitoring of via/Contact Holes Etch Process Based on Test Structures in Semiconductor Wafer Manufacturing
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2009
From: ZHAO, YAN; YEH, CHANG-CHUN; CHEN, ZHONGWEI; JAU, JACK
To: HERMES-MICROVISION, INC.
Reel/Frame 022846/0068 →
Assignment of Assignor's Interest
Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
Assignment of Assignor's Interest
Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →