IP Library Granted Patent US 9,400,176
Granted Patent B2
US 9,400,176 · App. 14/306,298 · Granted Jul 26, 2016

Dynamic focus adjustment with optical height detection apparatus in electron beam system

Inventors: Joe Wang (Campbell, CA); Van-Duc Nguyen (Fremont, CA); Yi-Xiang Wang (Fremont, CA); Jack Jau (Los Altos Hills, CA); Zhong-Wei Chen (San Jose, CA)
Assignee: HERMES MICROVISION, INC.
G01B11/22G01N23/04G01N23/20058H01J37/21H01J37/28G01N2223/32G01N2223/3301G01N2223/3302G01N2223/646H01J2237/216H01J2237/2482H01J2237/2487
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Quick Facts
Patent No.
US 9,400,176
App. No.
14/306,298
Granted
Jul 26, 2016
Kind
B2
Abstract

The present invention generally relates to dynamic focus adjustment for an image system. With the assistance of a height detection sub-system, present invention provides an apparatus and methods for micro adjusting an image focusing according the specimen surface height variation by altering the field strength of an electrostatic lens between objective lens and sample stage/or a bias voltage applied to the sample surface. Merely by way of example, the invention has been applied to a scanning electron inspection system. But it would be recognized that the invention could apply to other system using charged particle beam as observation tool with a height detection apparatus.

Claims (47)

1. A device for dynamic measuring height variation of a specimen to be inspected by a tool, comprising:

an optical illuminating source for emitting light on the specimen;

a detecting unit for receiving light reflected from the specimen;

means for calculating a focus of the tool;

means for calculating bias of the specimen surface to a voltage according to the focus and scanning compensation while the specimen is inspected by a charged particle beam; and

means for controlling bias of the specimen surface to the voltage.

2. The device for dynamic measuring height variation according to claim 1 , further comprising an optical system for the optical illuminating source and the detecting unit.

3. The device for dynamic measuring height variation according to claim 1 , wherein the means for calculating bias of the specimen surface and scanning compensation includes:

image rotation compensation;

image magnification compensation; and

primary beam shift compensation.

4. An electron beam system, comprising:

an electron source for emitting a primary beam;

a condenser lens for condense the primary beam;

an objective lens for focusing the primary beam on a surface of a specimen; and

means for dynamically measuring height variation of the specimen;

wherein the means for measuring height variation of the specimen comprises an optical illuminating source for emitting light on the specimen, a detecting unit for receiving light reflected from the specimen, and means for calculating bias of the surface of the specimen to a voltage according to a focus and controlling bias of the surface of the specimen to the voltage while the specimen is inspected by the primary electron beam.

5. The electron beam system according to claim 4 , wherein the means for varying landing energy of the primary beam comprises:

means for calculating focus of the tool;

means for calculating bias of the specimen surface and scanning compensation; and

means for controlling bias of the specimen surface.

6. The electron beam system according to claim 5 , wherein the means for calculating bias of the specimen surface and scanning compensation includes:

image rotation compensation;

image magnification compensation; and

primary beam shift compensation.

7. The electron beam system according to claim 4 , wherein the means for varying landing energy of the primary beam comprises:

means for calculating focus of the tool;

means for calculating electrostatic strength of a control electrode and scanning compensation; and

means for controlling electrostatic strength of the control electrode.

8. The electron beam system according to claim 7 , wherein the means for calculating electrostatic strength of a control electrode and scanning compensation includes:

image rotation compensation;

image magnification compensation; and

primary beam shift compensation.

9. The electron beam system according to claim 4 , further comprising an optical system for the optical illuminating source and the detecting unit.

10. The electron beam system according to claim 4 , further comprising a deflection unit for deflecting the primary beam and scanning on the specimen.

11. The electron beam system according to claim 10 , further comprising a detector for receiving signal electrons from the specimen.

12. The electron beam system according to claim 11 , further comprising a control electrode, between the objective lens and the specimen, on extension of outer pole pieces of the objective lens.

13. A device for dynamically adjusting focus of an electron beam in a scanning electron microscope (SEM), said device comprising:

an optical height detection unit for detecting a surface of a specimen to be inspected by the SEM and outputting signals of height variation information;

a SEM focus control unit for receiving the signals of height variation information, calculating a focus, and outputting signals of focus adjusting information; and

a SEM focusing unit for focusing the electron beam of the SEM on the surface of the specimen according to the signals of focus adjusting information,

wherein said SEM focusing unit comprises

means for adjusting bias of the specimen's surface via calculating bias of the specimen's surface to a voltage according to the focus and controlling bias of the specimen's surface to the voltage while the specimen is inspected by the SEM, and

wherein said SEM focusing unit is selected from the group consisting of

a control electrostatic lens, and

a condenser lens,

the control electrostatic lens being a plate with a central hole to allow passage of a primary beam of the SEM therethrough, wherein the control electrode lens is under an objective lens of the SEM.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2014
From: WANG, JOE; NGUYEN, VAN-DUC; WANG, YI-XIANG; JAU, JACK; CHEN, ZHONG-WEI
To: HERMES MICROVISION, INC.
Reel/Frame 033657/0640 →
Continuity (2)
Continuation 12764902 · Apr 21, 2010
Related Publication 20140291517A1 · Oct 2, 2014