Method and system for fast inspecting defects
A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.
1. A method for fast inspecting defects by using an e beam tool, comprising:
scanning a surface of a wafer to generate a scanned raw data;
identifying suspicious defects or critical patterns in said scanned raw data by using a first image-processing algorithm with a first set of parameters;
saving scanned raw data from the scanning step as an original image;
identifying hot spots in said original image according to the suspicious defects or the critical patterns;
marking locations of the hot spots in said original image; and
reviewing the locations on the original image to identify defects on the surface using said first image-processing algorithm with a second set of parameters different from the first set of parameters;
reviewing the locations on the original image to identify defects on the surface using a second image-processing algorithm.
2. The method according to claim 1 , wherein the wafer includes a plurality of dies thereon.
3. The method according to claim 2 , wherein the suspicious defects or the critical patterns are identified in one die of the plurality of dies.
4. The method according to claim 3 , wherein the reviewing steps review the locations of the plurality of dies on the original image.
5. The method according to claim 3 , wherein the reviewing steps review the locations of all other dies on the original image.
6. The method according to claim 1 , wherein the scanning step is performed by using an E-beam inspection tool or an optical inspection tool.
7. A non-transitory computer readable medium encoded with a computer program implementing a method for fast inspecting defects by using an e beam tool, wherein the method comprises steps of:
scanning a surface of a wafer to generate a scanned raw data;
identifying suspicious defects or critical patterns in said scanned raw data by using a first image-processing algorithm with a first set of parameters;
saving scanned raw data from the scanning step as an original image;
identifying hot spots in said original image according to the suspicious defects or the critical patterns;
marking locations of the hot spots in said original image; and
reviewing the locations on the original image to identify defects on the surface using said first image-processing algorithm with a second set of parameters different from the first set of parameters;
reviewing the locations on the original image to identify defects on the surface using a second image-processing algorithm.
8. The non-transitory computer readable medium according to claim 7 , wherein the wafer includes a plurality of dies thereon.
9. The non-transitory computer readable medium according to claim 7 , wherein the suspicious defects or the critical patterns are identified in one die of the plurality of dies.
10. The non-transitory computer readable medium according to claim 9 , wherein the reviewing steps review the locations of the plurality of dies on the original image.
11. The non-transitory computer readable medium according to claim 9 , wherein the reviewing steps review the locations of all other dies on the original image.
12. The non-transitory computer readable medium according to claim 7 , wherein the scanning step is performed by using an E-beam inspection tool or an optical inspection tool.