Test structure for charged particle beam inspection and method for fabricating the same
A test structure and a method for fabricating the same are disclosed. The test structure includes a plurality of sampling lines over a substrate located between a plurality of a first grounding lines and a plurality of a second grounding lines. The sampling lines are selectively electrically coupled to the first grounding line or the second grounding line and include at least one programmed defect. A double-patterning fabricating approach is utilized to produce such test structure which may be applied to a charged particle beam such as an electron-beam defect inspection system.
1. A test structure, comprising:
a first grounding line, disposed over a substrate;
a second grounding line, disposed over said substrate; and
a plurality of sampling lines, disposed over said substrate and between said first grounding line and said second grounding line, wherein at least one programmed defect is located in at least one of said sampling lines.
2. The test structure as claimed in claim 1 , wherein said first grounding line is separated from said second grounding line.
3. The test structure as claimed in claim 1 , wherein said first grounding line is connected to said second grounding line.
4. The test structure as claimed in claim 1 , wherein each said sampling line is separated from one another.
5. The test structure as claimed in claim 1 , wherein the location of said programmed defect is programmable.
6. The test structure as claimed in claim 1 , wherein the type of said programmed defect comprises an electrical open or short.
7. The test structure as claimed in claim 1 , wherein
at least one of said sampling lines is grounded by being electrically coupled with said first grounding line or said second grounding line; and
at least one of said sampling lines is un-grounded by being electrically isolated from said grounding lines and from said grounded sampling lines.
8. The test structure as claimed in claim 7 , wherein said sampling lines are arranged such that said grounded sampling lines and said un-grounded sampling lines are interlaced.
9. The test structure as claimed in claim 7 , wherein every other said grounded sampling line is electrically coupled with said first grounding line while the remaining said grounded sampling lines are electrically coupled with said second grounding line.