Charged particle beam inspection method
An imaging method and apparatus for forming images of substantially the same area on a sample for defect inspection within the area are disclosed. The disclosed method includes line-scanning the charged particle beam over the area to form a plurality of n*Y scan lines by repeatedly forming a group of n scan lines for Y times. During the formation of each group of n scan lines, an optical beam is, from one line scan to another, selectively illuminated on the area prior to or simultaneously with scanning of the charged particle beam. In addition, during the formation of each group of n scan lines, a condition of illumination of the optical beam selectively changes from one line scan to another. The conditions at which individual n scan lines are formed are repeated for the formation of all Y groups of scan lines.
1. A method for forming a plurality of images on a sample for categorizing defects on said sample, wherein said sample comprises a first pixel column and a second pixel column comprising:
moving said sample continuously in a direction perpendicular to said first pixel column and said second pixel column, and from said first pixel column to said second pixel column;
line-scanning said first pixel column with a charged particle beam under a first photo-current condition;
line-scanning said first pixel column again with said charged particle beam under a second photo-current condition, wherein said second photo-current condition is different from said first photo-current condition;
line-scanning said second pixel column with said charged particle beam under said first photo-current condition; and
line-scanning said second pixel column again with said charged particle beam under said second photo-current condition;
wherein said sample is moved continuously at a speed allowing scanning processing to be done on each pixel column under different photo-current conditions.
2. The method of claim 1 , wherein said condition of illumination of said optical beam remains constant during one line scan.
3. The method of claim 1 , wherein said condition of illumination of said optical beam includes optical beam intensity, optical beam wavelength, optical beam energy, duration of illumination, or any combination thereof.
4. The method of claim 1 , wherein during the formation of each said group of n scan lines, at least two scan lines are formed at identical said condition of illumination of said optical beam.
5. The method of claim 1 , wherein said n*Y scan lines are spaced apart by a fixed distance d such that the product of n multiplied by d is equal to said predefined pixel size p (n*d=p).
6. The method of claim 1 , wherein said charged particle beam is offset by one or more lines along the line-to-line advancement direction.
7. The method of claim 1 , wherein each of formed said images is inspected independently.
8. The method of claim 1 , wherein formed said images are inspected collectively after being combined through mathematical operation.
9. The method of claim 1 , wherein each said image is formed from a collection of Y said scan lines correspondingly selected from each of said Y groups of n scan lines.
10. The method of claim 1 , wherein said predefined types of defects comprise the N+/P-well plug open defect, the P+/N-well plug open defect, N+/P-well plug leakage defect, P+/N-well plug leakage or any combination thereof.
11. The method of claim 1 , wherein illumination of said optical beam causes patterns of particular material or electrical properties in said area to display a brighter grey level.
12. The method of claim 1 , wherein X, Y and n are an integer equal to or greater than 2.
13. The method of claim 1 , wherein said condition of illumination of said optical beam is modulated on/off or to different power levels or selected from different sources of wavelength, in synchronization with said line-scanning.
14. A charged particle beam inspection system for categorizing defects on a sample with a first pixel column and a second pixel column, comprising:
a charged particle beam imaging apparatus for forming voltage contrast images of said sample by scanning a charged particle beam over said first pixel column and said second pixel column;
an optical beam apparatus for illuminating said sample to induce a first photo-current condition and a second photo-current condition on said sample, wherein said first photo-current condition is different from said second photo-current condition; and
a defect determination apparatus comprising a control module and an image analysis module, wherein said control module is coupled to and controls said charged particle beam imaging apparatus and said optical beam apparatus
wherein said charged particle beam imaging apparatus scans said first pixel column under said first photo-current condition, then scans said first pixel column under said second photo-current condition, then scans said second pixel column under said first photo-current condition, and then scans said second pixel column under said second photo-current condition; and
wherein said sample is moved continuously at a speed allowing scanning processing to be done on each pixel column under different photo-current conditions and said image analysis module is coupled with said charged particle beam imaging apparatus for receiving and analyzing said voltage contrast images from said charged particle beam imaging apparatus for categorizing types of defects on said sample.
15. The charged particle beam inspection system of claim 14 , wherein said condition of illumination of said optical beam remains constant during one line scan.
16. The charged particle beam inspection system of claim 14 , wherein during the formation of each said group of n scan lines, at least two scan lines are formed at identical said condition of illumination of said optical beam.
17. The charged particle beam inspection system of claim 14 , wherein said n*Y scan lines are spaced apart by a fixed distance d such that the product of n and d is equal to said predefined pixel size p (n*d=p).
18. The charged particle beam inspection system of claim 14 , wherein each said image is formed from a collection of Y said scan lines correspondingly selected from each of said Y groups of n scan lines.
19. The charged particle beam inspection system of claim 14 , wherein said charged particle beam imaging apparatus comprises:
a charged particle beam generator for generating a charged particle beam;
a condenser lens module for condensing the generated said charged particle beam;
an objective lens module for focusing the condensed said charged particle beam into a charged particle beam probe;
a deflection module for scanning said charged particle beam probe over the surface of said sample secured on a sample stage;
a detector module for collecting charged particles coming from said sample when it is scanned by said charged particle beam probe, and generating a detection signal accordingly; and
an image forming module coupled to said detector module for receiving said detection signal and accordingly forming said voltage contrast images of said sample.