Method and system for fast inspecting defects
A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.
1. A system for fast inspecting defects, comprising:
a charged particle beam probe generator for generating a charged particle beam probe;
a charged particle beam deflection module for deflecting the charged particle beam probe to scan across an area on a surface of a wafer, wherein the area includes one or more dies;
an image forming apparatus for detecting secondary charged particles emitted from the surface of the region of interest being bombarded by the charged particle beam probe and forming at least one scanned raw image of the area accordingly;
a storage module for saving the scanned raw image as an original image;
a defect inspection module encoded with a computer program configured to cause the defect inspection module to
identify defects on the scanned raw image by using a first image-processing algorithm with a first set of parameters; and
provide a list of locations on the scanned raw image that correspond to the defects for storing; and
a defect review module encoded with a computer program configured to cause the defect review module to review the locations on the original image to analyze the defects on the surface by
a first defect analysis that uses the first image-processing algorithm with a second set of parameters different from the first set of parameters; and
a second defect analysis that uses a second image-processing algorithm different from the first image-processing algorithm,
wherein the review of the locations on the original image comprises reproducing or dividing the original image and simultaneously performing the first defect analysis and the second defect analysis.
2. The system according to claim 1 , wherein the wafer includes a plurality of dies thereon.
3. The system according to claim 2 , wherein the defects are identified in one die of the plurality of dies.
4. The system according to claim 3 , wherein the review of the locations on the original image comprises a review of the locations of each of the plurality of dies on the original image.
5. The system according to claim 3 , wherein the review of the locations on the original image comprises a review of the locations of each of all other dies on the original image.
6. The system according to claim 1 , wherein the wafer includes a plurality of dies and the defects on the at least one scanned raw image include locations at two or more of the plurality of dies.
7. The system according to claim 1 , wherein the original image is greater than or equal to 20 tera-bytes.