Patent Assignment
Reel/Frame 015847/0027
Assignment of Assignor's Interest
Recorded: 2004-10-01
Pages: 3
Assignors
CHOU, CHIEN-KANG
Executed: 2004-08-27
CHOU, CHIU-MING
Executed: 2004-08-27
LIN, LI-REN
Executed: 2004-08-27
LIN, CHU-FU
Executed: 2004-08-27
Assignee
MEGIC CORPORATION
21 R&D FIRST RAOD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Wafer Level Processing Method and Structure to Manufacture Two Kinds of Interconnects, Gold and Solder, on One Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →