Patent Assignment
Reel/Frame 015853/0007
Assignment of Assignor's Interest
Recorded: 2004-10-01
Pages: 2
Assignor
OHSUMI, TAKASHI
Executed: 2004-07-09
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having Chip Size Package with Improved Strength
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.