Patent Assignment
Reel/Frame 015858/0522
Assignment of Assignor's Interest
Recorded: 2004-09-28
Pages: 2
Assignor
HUANG, CHIEN-PING
Executed: 2004-09-16
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG HSIEN TAIWAN, CHINA
Covered Property
(1)
Photosensitive Semiconductor Package, Method for Fabricating the Same, and Lead Frame Thereof