Patent Assignment
Reel/Frame 015859/0841
Assignment of Assignor's Interest
Recorded: 2004-10-01
Pages: 2
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, 100-6334, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Device Including a Bump Forming Process
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.