Patent Assignment
Reel/Frame 015866/0341
Change of Name
Recorded: 2004-10-07
Pages: 5
Assignors
UTMC MICROELECTRONICS SYSTEMS INC.
Executed: 2000-05-04
AEROFLEX UTMC MICROELECTRONIC SYSTEMS, INC.
Executed: 2003-08-29
Assignee
AEROFLEX COLORADO SPRINGS, INC.
4350 CENTINNAL BLVD., COLORADO SPRINGS, COLORADO, 80907
Covered Property
(1)
Radiation Hardened Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Sep 17, 2007
From: AEROFLEX COLORADO SPRINGS, INC.
To: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
Reel/Frame 019834/0442 →
Release of Security Interest in Intellectual Property Collateral
May 9, 2011
From: GOLDMAN SACHS CREDIT PARTNERS, L.P., AS COLLATERAL AGENT
To: AEROFLEX COLORADO SPRINGS, INC.
Reel/Frame 026247/0469 →
Security Agreement
Jun 10, 2011
From: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, NA, AS COLLATERAL AGENT
Reel/Frame 026422/0719 →
Release of Patent Security Interest
Sep 12, 2014
From: JPMRGAN CHASE BANK, N.A.
To: AEROFLEX INCORPORATED; AEROFLEX/WEINSCHEL, INC.; AEROFLEX COLORADO SPRINGS, INC.; AEROFLEX MICROELECTRONIC SOLUTIONS, INC.
Reel/Frame 033728/0942 →