IP Library › Assignment 015890/0001
Patent Assignment
Reel/Frame 015890/0001

Release and Termination of Intellectual Property Security Agreement

Recorded: 2005-04-12 Pages: 5
Assignor
Assignee
M CUBED TECHNOLOGIES, INC.
921 MAIN STREET, MONROE, CONNECTICUT, 06466
Covered Properties (2)
Silicon Carbide Armor Bodies, and Methods for Making Same
Patent: 6,609,452 →
Application: 09/757,826 →
Silicon carbide composite bonded structures, and methods for making same
Application: 60/264,000 →
Related Assignments (7)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest Apr 14, 2005
From: M CUBED TECHNOLOGIES, INC.
To: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 016446/0473 →
Security Agreement Apr 14, 2005
From: M CUBED TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 016446/0169 →
Release and Termination of Collateral Assignment Apr 26, 2005
From: BUSINESS ALLIANCE CAPITAL CORP.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 015942/0749 →
Release and Reassignment May 25, 2011
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 026427/0028 →
Notice of Grant of Security Interest in Patents Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
Assignment of Assignor's Interest Mar 7, 2020
From: M CUBED TECHNOLOGIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 052211/0105 →
Patent Release and Reassignment Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →