IP Library Assignment 052211/0105
Patent Assignment
Reel/Frame 052211/0105

Assignment of Assignor's Interest

Recorded: 2020-03-07 Pages: 8
Assignor
M CUBED TECHNOLOGIES, INC.
Executed: 2020-02-13
Assignee
II-VI DELAWARE, INC.
1105 NORTH MARKET STREET, SUITE I 300, WILMINGTON, DELAWARE, US 19801
Covered Properties (15)
Improved Silicon Carbide Composites and Methods for Making Same
Patent: 6,503,572 →
Application: 09/621,562 →
Silicon Carbide Armor Bodies, and Methods for Making Same
Patent: 6,609,452 →
Application: 09/757,826 →
Boron Carbide Composite Bodies, and Methods for Making Same
Patent: 6,862,970 →
Application: 09/990,175 →
Publication: US 2003/0110931
Low Expansion Metal-Ceramic Composite Bodies, and Methods for Making Same
Patent: 7,169,465 →
Application: 10/073,818 →
Warming Blanket Having Remote Safety Circuit
Patent: 6,730,887 →
Application: 10/242,905 →
Publication: US 2003/0047556
Toughness Enhanced Silicon-Containing Composite Bodies, and Methods for Making Same
Patent: 6,995,103 →
Application: 10/271,312 →
Publication: US 2003/0092558
Silicon Carbide Armor Bodies, and Methods for Making Same
Patent: 6,805,034 →
Application: 10/286,405 →
Silicon Carbide Composites and Methods for Making Same
Patent: 6,919,127 →
Application: 10/336,626 →
Publication: US 2003/0180579
Boron Carbide Composite Bodies, and Methods for Making Same
Patent: 7,332,221 →
Application: 10/432,456 →
Publication: US 2004/0065868
Ceramic-Rich Composite Armor, and Methods for Making Same
Patent: 7,104,177 →
Application: 10/649,381 →
Boron Carbide Composite Bodies, and Methods for Making Same
Patent: 7,197,972 →
Application: 11/073,975 →
Publication: US 2006/0169128
Silicon-Containing Composite Bodies, and Methods for Making Same
Patent: 7,658,781 →
Application: 11/185,075 →
Diamond-Reinforced Composite Materials and Articles,and Methods for Making Same
Patent: 8,474,362 →
Application: 12/313,372 →
Intermetallic-Containing Composite Bodies, and Methods for Making Same
Patent: 8,741,212 →
Application: 13/420,449 →
Publication: US 2012/0277087
Wafer Pin Chuck Fabrication and Repair
Patent: 9,941,148 →
Application: 15/062,168 →
Publication: US 2016/0276203
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2012
From: WAGGONER, W. MICHAEL; ROSSING, BARRY R.; RICHMOND, MICHEAL A.; AGHAJANIAN, MICHAEL K.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 028735/0769 →
Assignment of Assignor's Interest Aug 6, 2012
From: AGHAJANIAN, MICHAEL K.; MCCORMICK, ALLYN L.; MORGAN, BRADLEY N.; LISZKIEWICZ, JR., ANTHONY F.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 028735/0754 →
Assignment of Inventions Agreement Oct 12, 2012
From: ANDERSON, CLARENCE A.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 029133/0332 →
Change of Name Oct 12, 2012
From: LANXIDE PRECISION, INC.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 029132/0993 →
Assignment of Assignor's Interest Oct 12, 2012
From: KARANDIKAR, PRASHANT G.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 029133/0131 →
Assignment of Inventions Agreement Oct 12, 2012
From: SINGH, JAI
To: LANXIDE PRECISION, INC.
Reel/Frame 029133/0226 →
Assignment of Inventions Agreement Oct 13, 2012
From: WAGGONER, W. MICHAEL; RICHMOND, MICHAEL A.; AGHAJANIAN, MICHAEL K.; MCCORMICK, ALLYN L.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 029133/0117 →
Change of Name Oct 13, 2012
From: M3 TECHNOLOGIES, INC.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 029133/0046 →
Assignment of Inventions Agreement Oct 13, 2012
From: ROSSING, BARRY R.
To: M3 TECHNOLOGIES, INC.
Reel/Frame 029133/0050 →
Assignment of Assignor's Interest Jun 30, 2015
From: AGHAJANIAN, MICHAEL K.; MCCORMICK, ALLYN L.; EPPERLY, MICHAEL S.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 036053/0692 →
Notice of Grant of Security Interest in Patents Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
Security Interest Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
Patent Release and Reassignment Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →