IP Library Granted Patent US 7,332,221
Granted Patent B2
US 7,332,221 · App. 10/432,456 · Granted Feb 19, 2008

Boron carbide composite bodies, and methods for making same

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Quick Facts
Patent No.
US 7,332,221
App. No.
10/432,456
Granted
Feb 19, 2008
Kind
B2
Abstract

A composite body produced by a reactive infiltration process that possesses high mechanical strength, high hardness and high stiffness has applications in such diverse industries as precision equipment and ballistic armor. Specifically, the composite material features a boron carbide filler or reinforcement phase, and a silicon component with a porous mass having a carbonaceous component. Potential deleterious reaction of the boron carbide with silicon during infiltration is suppressed by alloying or dissolving boron into the silicon prior to contact of the silicon infiltrant with the boron carbide. In a preferred embodiment of the invention related specifically to armor, good ballistic performance can be advanced by loading the porous mass or preform to be infiltrated to a high degree with one or more hard fillers such as boron carbide, and by limiting the size of the largest particles making up the mass. The instant reaction bonded silicon carbide (RBSC) composite bodies surpass previous RBSC's as armor materials, and in this capacity approach the ballistic performance of current carbide armor ceramics but with potentially lower cost manufacturing methods, e.g., infiltration techniques.

Claims (8)

1. A composite material, comprising:

a matrix comprising silicon carbide;

an at least partially interconnected material distributed throughout said matrix, said material consisting essentially of elemental silicon and at least one substance comprising boron; and

at least one reinforcement material comprising boron carbide, said reinforcement material also distributed throughout said matrix, said reinforcement material comprising at least one morphology selected from the group consisting of particulate, flakes, microspheres and aggregate, said boron carbide being substantially unaffected by said silicon, and further wherein said reinforcement material comprises a plurality of grains of at least one filler material, and wherein at least 90 volume percent of said filler material grains are smaller than about 55 microns in diameter.

2. A composite material, comprising:

a matrix component comprising silicon carbide;

an at least partially interconnected material distributed throughout said matrix component, said material comprising silicon and at least one source of boron; and

at least one reinforcement component comprising boron carbide, wherein at least 85 percent by volume of said reinforcement component comprises a plurality of bodies smaller than about 75 microns in size, said reinforcement component also distributed throughout said matrix component, said boron carbide being substantially unaffected by said silicon.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2020
From: M CUBED TECHNOLOGIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 052211/0105 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →