IP Library Granted Patent US 6,862,970
Granted Patent B2
US 6,862,970 · App. 09/990,175 · Granted Mar 8, 2005

Boron carbide composite bodies, and methods for making same

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Quick Facts
Patent No.
US 6,862,970
App. No.
09/990,175
Granted
Mar 8, 2005
Kind
B2
Abstract

A composite body produced by a reactive infiltration process that possesses high mechanical strength, high hardness and high stiffness has applications in such diverse industries as precision equipment and ballistic armor. Specifically, the composite material features a boron carbide filler or reinforcement phase, and a silicon carbide matrix produced by the reactive infiltration of an infiltrant having a silicon component with a porous mass having a carbonaceous component. Potential deleterious reaction of the boron carbide with silicon during infiltration is suppressed by alloying or dissolving boron into the silicon prior to contact of the silicon infiltrant with the boron carbide. In a preferred embodiment of the invention related specifically to armor, good ballistic performance can be advanced by loading the porous mass or preform to be infiltrated to a high degree with one or more hard fillers such as boron carbide, and by limiting the size of the largest particles making up the mass. The instant reaction-bonded silicon carbide (RBSC) composite bodies surpass previous RBSC's as armor materials, and in this capacity approach the ballistic performance of current carbide armor ceramics but with potentially lower cost manufacturing methods, e.g., infiltration techniques.

Claims (43)

1. A ballistic armor, comprising:

at least one body having a front face and a rear face, the front face being the surface upon which a ballistic projectile impinges on said body, the body comprising a composite material having a hardness of at least about 1100 kg/mm 2 as measured with a Vickers indenter using a 1 kilogram load, the composite material further comprising

(a) a matrix comprising silicon carbide crystallites, wherein at least about 90 volume percent of crystallites of said silicon carbide are smaller than about 100 microns in diameter;

(b) at least 65 percent by volume of a reinforcement phase comprising at least one filler material comprising boron carbide dispersed throughout said matrix; and

(c) an infiltrant phase comprising silicon dispersed throughout said matrix.

2. The ballistic armor of claim 1 , wherein said at least one filler material comprises a plurality of crystallites, and further wherein at least 90 volume percent of said filler material crystallites are smaller than about 100 microns in diameter.

3. The ballistic armor of claim 2 , wherein substantially all of said filler material crystallites are smaller than about 106 microns in diameter.

4. The ballistic armor of claim 2 , wherein substantially all of said filler material crystallites are smaller than about 90 microns in diameter.

5. The ballistic armor of claim 2 , wherein at least 90 volume percent of said filler material crystallites are smaller than about 55 microns in diameter.

6. The ballistic armor of claim 2 , wherein at least 85 volume percent of said filler material crystallites are smaller than about 75 microns in diameter.

7. The ballistic armor of claim 2 , wherein at least 97 volume percent of said filler material crystallites are smaller than about 70 microns in diameter.

8. The ballistic armor of claim 1 , wherein said infiltrant phase has dissolved therein at least one substance comprising boron.

9. The ballistic armor of claim 1 , wherein said composite material comprises no more than about 30 percent by volume of said infiltrant phase.

10. The ballistic armor of claim 1 , wherein said matrix comprises no more than about 24 percent by volume of silicon carbide produced in-situ.

11. The ballistic armor of claim 1 , further comprising a backing layer contacting said rear face of said at least one body.

12. The ballistic armor of claim 11 , wherein said infiltrant phase has dissolved therein at least one source of boron.

13. The ballistic armor of claim 11 , wherein said composite material comprises reaction-bonded boron carbide.

14. The ballistic armor of claim 11 , wherein said composite material comprise at least 65 percent by volume of said filler material.

15. The ballistic armor of claim 11 , wherein said backing layer comprises at least one fiber-reinforced plastic material.

16. The ballistic armor of claim 15 , wherein said fiber comprises at least one material selected from the group consisting of polyethylene, aramid and glass.

17. A ballistic armor, comprising a generally plate-shaped body, the body comprising:

a composite material comprising

(a) a reinforcement phase comprising boron carbide;

(b) a matrix comprising silicon carbide; and

(c) no more than about 30 percent by volume of an infiltrant phase comprising silicon dispersed throughout said matrix phase,

the body furthermore having a mass efficiency of at least about 4.1 when tested under the following conditions:

7.62 mm projectile

unit layers of polymer composite backing materials, each of said unit layers consisting of two tapes of unidirectional extended-chain polyethylene fibers in a thermoplastic resin matrix, cross-plied at right angles to one another

total armor system areal density of about 29 kg/m2

outer tactical vest simulant comprising 28 plies of 600 denier KM2 blanket comprising rip-stop nylon.

18. The ballistic armor of claim 17 , wherein said body has a four-point flexural strength of at least about 200 MPa.

19. The ballistic armor of claim 17 , wherein said body has a four-point flexural strength of at least about 260 MPa.

20. The ballistic armor of claim 17 , wherein substantially all of said boron carbide is smaller than 45 microns in crystallite size.

21. The ballistic armor of claim 17 , wherein said body has a hardness of at least about 1670 kg/mm 2 as measured with a Vickers indenter using a 1 kg load.

22. The ballistic armor of claim 21 , wherein said composite material further comprises at least 70 percent by volume of said boron carbide.

23. The ballistic armor of claim 17 , wherein at least said matrix and said at least one filler material comprises crystallites, and further wherein no more than about 10 percent of the total volume of said crystallites are larger than about 100 microns in diameter.

24. The ballistic armor of claim 17 , wherein said infiltrant phase has dissolved therein at least one substance comprising boron.

25. The ballistic armor of claim 17 , further comprising a ballistic stopping power of at least 90% that of armor grade boron carbide when tested under the following conditions:

7.62 mm projectile

unit layers of polymer composite backing material, each of said unit layers consisting of two tapes of unidirectional extended-chain polyethylene fibers in a thermoplastic resin matrix, cross-plied at right angles to one another

total armor system areal density of about 30 kg/m 2

an outer tactical vest simulant comprising 28 plies of 600 denier KM2 blanket having rip-stop nylon

armor grade boron carbide plate thickness of about 0.69 cm.

Assignments (9)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2020
From: M CUBED TECHNOLOGIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 052211/0105 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
RELEASE AND REASSIGNMENT Recorded May 25, 2011
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 026427/0028 →
RELEASE AND TERMINATION OF COLLATERAL ASSIGNMENT Recorded Apr 26, 2005
From: BUSINESS ALLIANCE CAPITAL CORP.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 015942/0749 →
SECURITY AGREEMENT Recorded Apr 14, 2005
From: M CUBED TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 016446/0169 →
SECURITY INTEREST Recorded Apr 14, 2005
From: M CUBED TECHNOLOGIES, INC.
To: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 016446/0473 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 19, 2003
From: M CUBED TECHNOLOGIES, INC.
To: BUSINESS ALLIANCE CAPITAL CORP.
Reel/Frame 014078/0598 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2002
From: AGHAJANIAN, MICHAEL K.; MCCORMICK, ALLYN L.; MORGAN, BRADLEY N.; LISZKIEWICZ, ANTHONY F. JR.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 012993/0946 →