IP Library Granted Patent US 8,741,212
Granted Patent B2
US 8,741,212 · App. 13/420,449 · Granted Jun 3, 2014

Intermetallic-containing composite bodies, and methods for making same

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Quick Facts
Patent No.
US 8,741,212
App. No.
13/420,449
Granted
Jun 3, 2014
Kind
B2
Abstract

Composite bodies made by a silicon metal infiltration process that feature a silicon intermetallic, e.g., a metal silicide. Not only does this give the composite material engineer greater flexibility in designing or tailoring the physical properties of the resulting composite material, but the infiltrant also can be engineered compositionally to have much diminished amounts of expansion upon solidification, thereby enhancing net-shape-making capabilities. These and other consequences of engineering the metal component of composite bodies made by silicon infiltration permit the fabrication of large structures of complex shape.

Claims (24)

1. A method for making a composite material, comprising:

providing a porous mass comprising at least one reinforcement material, wherein said porous mass contains no infiltration-facilitating carbon;

providing an infiltrant material comprising silicon and at least one metal comprising titanium;

heating said infiltrant material to a temperature above the liquidus temperature of said infiltrant material to form a molten infiltrant material;

communicating said molten infiltrant material into contact with said porous mass;

infiltrating said molten infiltrant material into said porous mass and reacting at least a portion of said titanium with at least a portion of said silicon to form a composite body comprising said at least one reinforcement material, and at least one titanium-silicon intermetallic compound distributed through said at least one reinforcement material, said titanium-silicon intermetallic compound being at least partially interconnected; and

solidifying said molten infiltrant material.

2. The method of claim 1 , wherein said infiltrating is conducted in a non-oxidizing environment.

3. The method of claim 1 , wherein said infiltrant material comprises at least 10 percent by weight of said titanium.

4. The method of claim 1 , wherein said at least one reinforcement material comprises a substance selected from the group consisting of carbides, borides, nitrides and oxides.

5. The method of claim 1 , wherein said reinforcement material comprises bodies ranging in size from submicron to about 5 millimeters.

6. The method of claim 1 , wherein said reinforcement material comprises a plurality of individual bodies.

7. The method of claim 1 , wherein said at least one reinforcement material has a morphology selected from the group consisting of particulates, fibers, platelets, flakes, and reticulated structures.

8. The method of claim 1 , wherein said porous mass comprises by volume from about 10 percent to about 85 percent of said reinforcement material.

9. The method of claim 1 , wherein said reinforcement material comprises at least one substance selected from the group consisting of SiC, B 4 C, TiC, WC, Si 3 N 4 , TiN, AlN, SiB 4 , TiB 2 , AlB 2 , Al 2 O 3 and MgO.

10. The method of claim 1 , wherein said composite body further comprises at least one of elemental titanium and elemental silicon.

11. The method of claim 1 , wherein said infiltrating is conducted in vacuum.

12. The method of claim 1 , wherein said infiltrant comprises at least about 15 percent by weight of titanium.

13. The method of claim 1 , wherein said temperature is about 1520C.

14. The method of claim 1 , wherein said titanium-silicon intermetallic compound comprises at least one of TiSi and TiSi 2 .

15. The method of claim 1 , wherein said infilttrant material further comprises dissolved boron.

16. The method of claim 15 , wherein said infiltrant material further comprises dissolved carbon.

17. The method of claim 1 , wherein said infiltrant material is provided as a reservoir.

18. The method of claim 1 , wherein said solidifying comprises directional solidification.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 7, 2020
From: M CUBED TECHNOLOGIES, INC.
To: II-VI DELAWARE, INC.
Reel/Frame 052211/0105 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2015
From: AGHAJANIAN, MICHAEL K.; MCCORMICK, ALLYN L.; EPPERLY, MICHAEL S.
To: M CUBED TECHNOLOGIES, INC.
Reel/Frame 036053/0692 →