IP Library Assignment 015921/0904
Patent Assignment
Reel/Frame 015921/0904

Assignment of Assignor's Interest

Recorded: 2004-10-21 Pages: 2
Assignors
CHIA-HUA CHANG
Executed: 2004-08-26
JEN-CHIN WU
Executed: 2004-08-26
Assignee
CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
NO. 481, JIA-AN SEC., JHONGJHENG RD., LONGTAN TOWNSHIP, TAOYUAN COUNTY 325, R.O.C., TAIWAN
Covered Property (1)
Method for Enhancing Bonding Strength of a Metal Spraying Thickened Layer of Electroformed Mold Inserts
Patent: 7,270,732 →
Application: 10/968,997 →
Publication: US 2006/0086615
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 17, 2015
From: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
To: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 035453/0240 →