Patent Assignment
Reel/Frame 015922/0318
Assignment of Assignor's Interest
Recorded: 2005-04-20
Pages: 3
Assignors
SUGA, TADATOMO
Executed: 2005-03-30
KIM, TAEBYUN
Executed: 2005-03-24
ABE, TOMOYUKI
Executed: 2005-04-06
Assignees
AYUMI INDUSTRY CO., LTD.
60 KAGUMACHI, BESSHOCHO, HIMEJI-SHI, HYOGO 671-0225, JAPAN
SUGA, TADATOMO
3-6-3 HIGASHINAKANO, NAKANO-KU, TOKYO 164-0003, JAPAN
Covered Property
(1)
Method for Bonding Substrates and Method for Irradiating Particle Beam to Be Utilized Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.