Assignment of Assignor's Interest

Recorded: 2012-07-10 Pages: 4

Assignors

AYUMI INDUSTRY CO., LTD.

Executed: 2012-06-18

SUGA, TADATOMO

Executed: 2012-06-13

Assignees

AUYMI INDUSTRY CO., LTD.

60 KAGUMACHI, BESSHOCHO, HIMEJI-SHI, HYOGO, 671-0225, JAPAN

SUGA, TADATOMO

3-6-3 HIGASHINAKANO; NAKANO-KU, TOKYO, 164-0003, JAPAN

BONDTECH CO., LTD.

1-25, NISHINOHATA, OKUBO-CHO, UJI-CITY, KYOTO, 611-0033, JAPAN

Covered Property (1)

Method for Bonding Substrates and Method for Irradiating Particle Beam to Be Utilized Therefor

Patent: 7,686,912 →

Application: 10/928,851 →

Publication: US 2005/0173057

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.