Patent Assignment
Reel/Frame 015935/0796
Assignment of Assignor's Interest
Recorded: 2004-10-27
Pages: 4
Assignors
PARK, SANG-BAE
Executed: 2004-10-04
LEE, YONG-GILL
Executed: 2004-10-04
PARK, HYUNG-JUN
Executed: 2004-10-04
RHO, KYUNG-SOO
Executed: 2004-10-04
WON, JIN-HEE
Executed: 2004-10-04
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
NO. 26, CHIN 3RD., NANTZE ESPORT, PROCESSING ZONE, KAOHSIUNG, R.O.C., TAIWAN
Covered Property
(1)
Method for Fabricating Leadless Packages with Mold Locking Characteristics