Patent Assignment
Reel/Frame 015938/0511
Assignment of Assignor's Interest
Recorded: 2004-11-01
Pages: 3
Assignors
KIM, IL-GOO
Executed: 2004-09-22
HAH, SANG-ROK
Executed: 2004-09-25
SON, SAE-IL
Executed: 2004-09-24
LEE, KYOUNG-WOO
Executed: 2004-09-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, KYUNGKI-DO, SUWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Metal Interconnection Layer of Semiconductor Device