Patent Assignment
Reel/Frame 015968/0428
Assignment of Assignor's Interest
Recorded: 2004-11-03
Pages: 2
Assignor
OZAWA, KEN
Executed: 2004-10-29
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Property
(1)
Semiconductor Device with Multi-Layered Wiring Arrangement Including Reinforcing Patterns, and Production Method for Manufacturing Such Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.