Patent Assignment
Reel/Frame 015975/0035
Assignment of Assignor's Interest
Recorded: 2004-11-05
Pages: 2
Assignors
HUANG, JUNG-PIN
Executed: 2004-08-27
CHANG, CHIN-HUANG
Executed: 2004-08-27
LIU, CHUNG-LUN
Executed: 2004-08-27
Assignee
SILICONWARE PRECISION INDUSTRIES CO., LTD.
NO. 123, SEC. 3, DA FONG ROAD, TANTZU, TAICHUNG HSIEN, TAIWAN
Covered Property
(1)
Semiconductor Package with Stacked Chips and Method for Fabricating the Same