IP Library Assignment 015984/0985
Patent Assignment
Reel/Frame 015984/0985

Assignment of Assignor's Interest

Recorded: 2005-05-09 Pages: 3
Assignor
VOLDMAN, STEVEN H.
Executed: 2005-05-02
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Interconnect Structure Encased with High and Low K Interlevel Dielectrics
Patent: 7,411,305 →
Application: 10/908,359 →
Publication: US 2006/0249787
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036267/0191 →