IP Library Assignment 036267/0191
Patent Assignment
Reel/Frame 036267/0191

Assignment of Assignor's Interest

Recorded: 2015-08-06 Pages: 5
Assignor
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
121, PARK AVE.3, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Properties (21)
Method and Material for Integration of Fuorine-Containing Low-K Dielectrics
Patent: 6,265,779 →
Application: 09/132,608 →
Damascene Etchback for Low E Dielectric
Patent: 6,331,481 →
Application: 09/225,477 →
Structure Comprising an Interlayer of Palladium and/or Platinum and Method for Fabrication Thereof
Patent: 6,911,229 →
Application: 10/215,324 →
Publication: US 2004/0028882
Copper Recess Process with Application to Selective Capping and Electroless Plating
Patent: 6,975,032 →
Application: 10/319,967 →
Publication: US 2004/0113279
Interlevel Dielectric Layer and Metal Layer Sealing
Patent: 7,214,608 →
Application: 10/710,706 →
Publication: US 2006/0024961
Electroplated Cowp Composite Structures as Copper Barrier Layers
Patent: 7,193,323 →
Application: 10/714,966 →
Publication: US 2005/0104216
Interconnect Structure Encased with High and Low K Interlevel Dielectrics
Patent: 7,411,305 →
Application: 10/908,359 →
Publication: US 2006/0249787
Electroplated Cowp Composite Structures as Copper Barrier Layers
Patent: 7,217,655 →
Application: 11/047,652 →
Publication: US 2005/0127518
Copper Recess Process with Application to Selective Capping and Electroless Plating
Patent: 7,064,064 →
Application: 11/058,783 →
Publication: US 2005/0158985
Low Cost Bonding Pad and Method of Fabricating Same
Patent: 7,245,025 →
Application: 11/164,653 →
Publication: US 2007/0120216
Sub-Lithographic Dimensioned Air Gap Formation and Related Structure
Patent: 7,943,480 →
Application: 12/029,800 →
Publication: US 2009/0200636
Fluorine Depleted Adhesion Layer for Metal Interconnect Structure
Patent: 8,039,964 →
Application: 12/038,241 →
Publication: US 2009/0212439
Design Structure for Final via Designs for Chip Stress Reduction
Patent: 7,439,170 →
Application: 12/044,692 →
Alpha Particle Blocking Wire Structure and Method Fabricating Same
Patent: 8,129,267 →
Application: 12/052,881 →
Publication: US 2012/0028458
Interconnect Structure Encased with High and Low K Interlevel Dielectrics
Patent: 7,521,359 →
Application: 12/054,681 →
Publication: US 2008/0169572
Design Structure for Final via Designs for Chip Stress Reduction
Patent: 7,545,050 →
Application: 12/183,369 →
Robust Fbeol and Ubm Structure of C4 Interconnects
Patent: 8,227,918 →
Application: 12/560,769 →
Publication: US 2011/0063815
Fluorine Depleted Adhesion Layer for Metal Interconnect Structure
Patent: 8,563,423 →
Application: 13/192,120 →
Publication: US 2011/0281432
Robust Febol and Ubm Structure of C4 Interconnects
Patent: 8,450,849 →
Application: 13/478,076 →
Publication: US 2012/0286433
Fluorine Depleted Adhesion Layer for Metal Interconnect Structure
Patent: 8,871,636 →
Application: 14/047,521 →
Publication: US 2014/0038407
Fluorine Depleted Adhesion Layer for Metal Interconnect Structure
Patent: 8,765,597 →
Application: 14/047,554 →
Publication: US 2014/0038408
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 11, 1998
From: GRILL, ALFRED; JAHNES, CHRISTOPHER VINCENT; PATEL, VISHNUBHAI VITTHALBHAI; SAENGER, KATHERINE LYNN
To: IBM CORPORATION
Reel/Frame 009385/0452 →
Assignment of Assignor's Interest Jan 4, 1999
From: STAMPER, ANTHONY K.; MCGAHAY, VINCENT J.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 009699/0482 →
Assignment of Assignor's Interest Dec 16, 2002
From: CHEN, SHYNG-TSONG; DALTON, TIMOTHY J.; DAVIS, KENNETH M.; HU, CHAO-KUN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 013594/0122 →
Assignment of Assignor's Interest Jan 13, 2003
From: ANDRICACOS, PANAYOTIS C.; BOETTCHER, STEVEN H.; MCFEELY, FENTON R.; PAUNOVIC, MILAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 013662/0225 →
Assignment of Assignor's Interest Nov 18, 2003
From: CABRAL, JR., CYRIL; CHIRAS, STEFANIE R.; COOPER, EMANUEL; DELIGIANNI, HARIKLIA
To: INTERNATIONAL BUSINESS MACHINES
Reel/Frame 014714/0786 →
Assignment of Assignor's Interest Jul 29, 2004
From: ANGYAL, MATTHEW S.; BIOLSI, PETER E.; CLEVENGER, LAWRENCE A.; HICHRI, HABIB
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 014932/0158 →
Assignment of Assignor's Interest May 9, 2005
From: VOLDMAN, STEVEN H.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 015984/0985 →
Assignment of Assignor's Interest Nov 30, 2005
From: BRIGANTE, JEFFREY ALAN; HE, ZHONG-XIANG; WATERHOUSE, BARBARA ANN; WHITE, ERIC JEFFREY
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 016834/0150 →
Assignment of Assignor's Interest Feb 15, 2008
From: EDELSTEIN, DANIEL C.; FULLER, NICHOLAS C.M.; HORAK, DAVID V.; HUANG, ELBERT E.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 020513/0933 →
Assignment of Assignor's Interest Feb 28, 2008
From: FAROOQ, MUKTA G.; KINSER, EMILY R.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 020574/0209 →
Assignment of Assignor's Interest Mar 7, 2008
From: DAUBENSPECK, TIMOTHY HARRISON; SAUTER, WOLFGANG; GAMBINO, JEFFREY P.; QUESTAD, DAVID
To: INTERNATIONAL BUSINESS MACHINE CORPORATION
Reel/Frame 020618/0736 →
Assignment of Assignor's Interest Mar 21, 2008
From: CABRAL, CYRIL, JR.; MULLER, K. PAUL; RODBELL, KENNETH P.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 020683/0806 →
Assignment of Assignor's Interest Jul 31, 2008
From: DAUBENSPECK, TIMOTHY HARRISON; SAUTER, WOLFGANG; GAMBINO, JEFFREY P.; QUESTAD, DAVID L.
To: INTERNATIONAL BUSINESS MACHINE CORPORATION
Reel/Frame 021323/0080 →
Assignment of Assignor's Interest Sep 16, 2009
From: LU, MINHUA; PERFECTO, ERIC D.; QUESTAD, DAVID L.; RAY, SUDIPTA K.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 023240/0627 →