IP Library Assignment 020618/0736
Patent Assignment
Reel/Frame 020618/0736

Assignment of Assignor's Interest

Recorded: 2008-03-07 Pages: 6
Assignors
DAUBENSPECK, TIMOTHY HARRISON
Executed: 2008-02-28
SAUTER, WOLFGANG
Executed: 2008-02-28
GAMBINO, JEFFREY P.
Executed: 2008-02-28
QUESTAD, DAVID
Executed: 2008-02-25
Assignee
INTERNATIONAL BUSINESS MACHINE CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Design Structure for Final via Designs for Chip Stress Reduction
Patent: 7,439,170 →
Application: 12/044,692 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036267/0191 →