IP Library Assignment 020574/0209
Patent Assignment
Reel/Frame 020574/0209

Assignment of Assignor's Interest

Recorded: 2008-02-28 Pages: 2
Assignors
FAROOQ, MUKTA G.
Executed: 2008-02-21
KINSER, EMILY R.
Executed: 2008-02-21
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Fluorine Depleted Adhesion Layer for Metal Interconnect Structure
Patent: 8,039,964 →
Application: 12/038,241 →
Publication: US 2009/0212439
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036267/0191 →