IP Library Assignment 014714/0786
Patent Assignment
Reel/Frame 014714/0786

Assignment of Assignor's Interest

Recorded: 2003-11-18 Pages: 6
Assignors
CABRAL, JR., CYRIL
Executed: 2003-11-06
CHIRAS, STEFANIE R.
Executed: 2003-11-07
COOPER, EMANUEL
Executed: 2003-11-07
DELIGIANNI, HARIKLIA
Executed: 2003-11-07
KELLOCK, ANDREW J.
Executed: 2003-11-06
RUBINO, JUDITH M.
Executed: 2003-11-07
TSAI, ROGER Y.
Executed: 2003-11-07
Assignee
INTERNATIONAL BUSINESS MACHINES
OLD ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Electroplated Cowp Composite Structures as Copper Barrier Layers
Patent: 7,193,323 →
Application: 10/714,966 →
Publication: US 2005/0104216
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036267/0191 →