IP Library Assignment 021323/0080
Patent Assignment
Reel/Frame 021323/0080

Assignment of Assignor's Interest

Recorded: 2008-07-31 Pages: 6
Assignors
DAUBENSPECK, TIMOTHY HARRISON
Executed: 2008-07-22
SAUTER, WOLFGANG
Executed: 2008-07-22
GAMBINO, JEFFREY P.
Executed: 2008-07-22
QUESTAD, DAVID L.
Executed: 2008-07-22
Assignee
INTERNATIONAL BUSINESS MACHINE CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Design Structure for Final via Designs for Chip Stress Reduction
Patent: 7,545,050 →
Application: 12/183,369 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 6, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 036267/0191 →