Patent Assignment
Reel/Frame 015988/0715
Assignment of Assignor's Interest
Recorded: 2004-11-15
Pages: 2
Assignors
TAKAI, KENJI
Executed: 2004-11-08
MORIIKE, NORIO
Executed: 2004-11-08
KAMIYAMA, KENICHI
Executed: 2004-11-08
MASUDA, KATSUYUKI
Executed: 2004-11-08
HASEGAWA, KIYOSHI
Executed: 2004-11-08
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Formation Method of Metal Layer on Resin Layer, Printed Wiring Board, and Production Method Thereof