Patent Assignment
Reel/Frame 016001/0829
Assignment of Assignor's Interest
Recorded: 2004-11-19
Pages: 3
Assignors
MINAMIHABA, GAKU
Executed: 2004-09-14
FUKUSHIMA, DAI
Executed: 2004-09-14
YAMAMOTO, SUSUMU
Executed: 2004-09-15
YANO, HIROYUKI
Executed: 2004-09-14
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO 105-8001, JAPAN
Covered Property
(1)
Slurry for Cmp, Polishing Method and Method of Manufacturing Semiconductor Device