IP Library › Assignment 016001/0996
Patent Assignment
Reel/Frame 016001/0996

Assignment of Assignor's Interest

Recorded: 2004-11-16 Pages: 3
Assignors
SONG, KONG LAM
Executed: 2004-05-31
CHOE, PENG CHEONG
Executed: 2004-06-01
MEDINA, TIC
Executed: 2004-06-05
Assignee
INTEGRATED DEVICE TECHNOLOGY, INC.
2975 STENDER WAY, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Automated Ball Mounting System with Solder Ball Testing
Patent: 7,392,924 →
Application: 10/990,123 →
Publication: US 2005/0279813
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
Release of Security Interest Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION
Reel/Frame 048746/0001 →