IP Library Assignment 016035/0476
Patent Assignment
Reel/Frame 016035/0476

Assignment of Assignor's Interest

Recorded: 2004-11-23 Pages: 4
Assignor
HSUEH-MING, TASI
Executed: 2004-11-22
Assignee
CHI MEI OPTOELECTRONICS CORP.
NO. 1, CHI-YEH ROAD, TAINAN COUNTY, TAINAN SCIENCE-BASED INDUSTRIAL PARK, 744 R.O.C, TAIWAN
Covered Property (1)
Configuration for Testing the Bonding Positions of Conductive Drops and Test Method for Using the Same
Patent: 7,145,252 →
Application: 10/996,652 →
Publication: US 2005/0121797
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger May 10, 2010
From: CHI MEI OPTOELECTRONICS CORP.
To: CHIMEI INNOLUX CORPORATION
Reel/Frame 024358/0221 →
Change of Name Apr 3, 2014
From: CHIMEI INNOLUX CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 032604/0487 →