Configuration for testing the bonding positions of conductive drops and test method for using the same
View Patent ↗Configuration for testing the bonding positions of conductive drops and test method by using the same is disclosed. In the invention, a special configured contact pad for setting a conductive drop and an associated wire pattern are useful for knowing the drop condition of single or several displaying panels. The contact pad comprises at least two conductive members respectively coupled to two wires; and an isolating portion between conductive members for separation. The normal dropping position of a conductive drop on the contact pad includes at least a portion of the conductive members. Accordingly, the contact pad is originally an open-circuit without conductive drop thereon, but the contact pad is conductive when the contact drop sets on its normal dropping position. Whether the conductive drop forms on the normal dropping position of the contact pad is determined by measuring the electrical properties of the contact pad.
1. A contact pad, applied to a substrate, and the contact pad is positioned on the substrate relative to a dropping position of a conductor, the contact pad comprising:
a first conductive member;
a second conductive member;
an insulating means interposing the first conductive member and the second conductive member; and
wherein the dropping position of the conductor involves at least a portion of the first conductive member and at least a portion of the second conductive member.
2. The contact pad according to claim 1 , wherein the insulating means is a gap.
3. The contact pad according to claim 1 , wherein the insulating means is an insulating material.
4. The contact pad according to claim 1 , wherein the first conductive member and the second conductive member are electrically connected when the conductor is disposed at the dropping position.
5. The contact pad according to claim 1 , wherein the contact pad is an open circuit if the conductor is not disposed on the dropping position.
6. A configuration for testing bonding position of conductor, applied to a substrate having a dropping position for a conductor, the configuration comprising:
at least two contact pads disposed on the substrate, and each contact pad at least comprising:
two conductive members; and
an insulating means positioned between the two conductive members; wherein each of the two contact pads have at least two wires extending therefrom, and wherein one of the at least two wires connects one contact pad to the other contact pad,
wherein the dropping position involves at least a portion of the conductive members of one of the contact pads; and
wherein at least one of the contact pads is disposed on the substrate approximately coincident to the dropping position.
7. The configuration according to claim 6 , wherein the conductive members of the contact pads are electrically connected if the conductor is provided at the dropping position.
8. The configuration according to claim 6 , wherein the conductor is a conductive glue, the conductive member is made of a conductive material and the insulating means is a gap.
9. The configuration according to claim 6 , wherein the conductor is a conductive glue, the conductive member is made of a conductive material and the insulating means is an insulating material.
10. The configuration according to claim 6 wherein for each contact pad one of the at least two wires extending therefrom extends to a test pad, and the test pad is used for testing whether the configuration is conductive.
11. The configuration according to claim 10 , wherein the test pad is made of a conductive material.
12. The configuration according to claim 6 , wherein the substrate is adapted to be electrically connected to another substrate by disposing the conductor on the dropping position.
13. The contact pad according to claim 1 , wherein the first conductive member is connected to one end of a first wire and the second conductive member is connected to one end of a second wire.
14. The contact pad according to claim 13 , wherein the conductor is a conductive glue; the first and second conductive members of the contact pad are made of a conductive material.
15. The contact pad according to claim 13 , wherein the substrate is electrically connected to another substrate by disposing the conductor on the contact pad.
16. A flat panel display comprising:
a first substrate;
a second substrate; and
a contact pad disposed on one of the substrates, the contact pad is positioned relative to a dropping position of a conductor, the contact pad including:
a first conductive member;
a second conductive member; and
an insulating means interposing the first conductive member and the second conductive member;
wherein the dropping position of the conductor involves at least a portion of the first conductive member and at least a portion of the second conductive member.
17. The flat panel display according to claim 16 , wherein the insulating means is a gap.
18. The flat panel display according to claim 16 , wherein the insulating means is an insulating material.
19. The flat panel display according to claim 16 , wherein the first conductive member connected to one end of a first wire; the second conductive member connected to one end of a second wire.
20. The flat panel display according to claim 16 , wherein the first conductive member and the second conductive member are electrically connected when the conductor is disposed at the dropping position.
21. The flat panel display according to claim 16 , wherein the contact pad is an open circuit if the conductor is not disposed on the dropping position.
22. The flat panel display according to claim 16 , wherein the conductor is a conductive glue; the first and second conductive members of the contact pad are made of a conductive material.
23. The flat panel display according to claim 16 , wherein the contact pad electrically connecting the first and second substrate through a conductor disposed on the contact pad.
24. The flat panel display according to claim 16 is a liquid crystal display (LCD), and the first substrate comprises thin film transistors (TFTs) and the second substrate comprises color filters (CFs), and a LC medium is filled between the first substrate and the second substrate.
25. The flat panel display according to claim 24 , wherein the contact pad is provided at the first substrate having TFTs.