Patent Assignment
Reel/Frame 016052/0547
Assignment of Assignor's Interest
Recorded: 2004-01-30
Pages: 3
Assignee
SONY DISC TECHNOLOGY INC.
7-35 KITASHINAGAWA 7-CHOME, SHINAGAWA-KU, TOKYO, 141-0001, JAPAN
Covered Property
(1)
Injection Molding Apparatus and Injection Molding Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.