Patent Assignment
Reel/Frame 016054/0760
Assignment of Assignor's Interest
Recorded: 2004-11-18
Pages: 3
Assignor
CHANG, WEN-YUAN
Executed: 2004-09-01
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 535, CHUNG-CHENG RD.,, HSIN-TIEN CITY, TAIPEI HSIEN, R.O.C., TAIWAN
Covered Property
(1)
Chip Embedded Package Structure