IP Library Assignment 016089/0730
Patent Assignment
Reel/Frame 016089/0730

Assignment of Assignor's Interest

Recorded: 2004-12-14 Pages: 3
Assignors
CHEN, CHIEN-HUA
Executed: 2004-11-30
GEISSLER, STEVEN R.
Executed: 2004-12-01
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
Wafer Packaging and Singulation Method
Patent: 7,682,934 →
Application: 11/011,640 →
Publication: US 2006/0088981
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →