Patent Assignment
Reel/Frame 016115/0018
Assignment of Assignor's Interest
Recorded: 2004-12-20
Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2004-12-02
CHOU, CHIU-MING
Executed: 2004-12-02
CHOU, CHIEN-KANG
Executed: 2004-12-02
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Top Layers of Metal for Integrated Circuits
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →