Patent Assignment
Reel/Frame 016123/0974
Assignment of Assignor's Interest
Recorded: 2004-12-23
Pages: 2
Assignor
TSAI, YU-PAN
Executed: 2004-10-27
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD., NANTZE EXPORT PROCESSING ZONE, KAOSHIUNG, R.O.C., TAIWAN
Covered Property
(1)
Method of Backside Grinding a Bumped Wafer