IP Library › Assignment 016126/0559
Patent Assignment
Reel/Frame 016126/0559

Assignment of Assignor's Interest

Recorded: 2004-12-21 Pages: 3
Assignor
ANDO, MASATERU
Executed: 2004-11-19
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Wafer and Dicing Method
Patent: 7,459,768 →
Application: 11/018,984 →
Publication: US 2005/0139964
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Assignment of Assignor's Interest May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032900/0568 →