Patent Assignment
Reel/Frame 016137/0335
Assignment of Assignor's Interest
Recorded: 2004-12-30
Pages: 3
Assignor
JUNG, BYUNG-HYUN
Executed: 2004-12-27
Assignee
DONGBUANAM SEMICONDUCTOR INC.
891-10, DAECHI-DONG, KANGNAM-KU, SEOUL 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Metal Wiring of Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.