Patent Assignment
Reel/Frame 016139/0214
Assignment of Assignor's Interest
Recorded: 2004-12-27
Pages: 3
Assignors
PARK, BYONG-CHEOL
Executed: 2004-12-22
SHIN, DONG-HWA
Executed: 2004-12-22
CHAE, SEUNG-KI
Executed: 2004-12-22
LEE, SANG-HO
Executed: 2004-12-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Exposing a Wafer to a Light, and Reticle, Reticle Assembly and Exposing Apparatus for Performing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.