Assignment of Assignor's Interest

Recorded: 2004-12-30 Pages: 3

Assignor

JUNG, MENG AN

Executed: 2004-12-24

Assignee

DONGBUANAM SEMICONDUCTOR INC.

891-10, DAECHI-DONG, KANGNAM-KU, SEOUL, KOREA, REPUBLIC OF

Covered Property (1)

Metal pad of semiconductor device and method for bonding the metal pad

Application: 11/024,699 →

Publication: US 2006/0024944

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.