Patent Assignment
Reel/Frame 016146/0165
Assignment of Assignor's Interest
Recorded: 2004-12-30
Pages: 3
Assignor
AHN, YONG SOO
Executed: 2004-12-27
Assignee
DONGBUANAM SEMICONDUCTOR, INC.
891-10 DAECHI-DONG, KANGNAM-KU, A KOREAN CORPORATION, SEOUL 135-523, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Metallic Interconnects in Semiconductor Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.