Assignment of Assignor's Interest

Recorded: 2004-12-30 Pages: 3

Assignor

HONG, JI HO

Executed: 2004-12-29

Assignee

DONGBUANAM SEMICONDUCTOR, INC.

891-10 DAECHI-DONG, KANGNAM-KU, SEOUL 135-523, KOREA, REPUBLIC OF

Covered Property (1)

Methods of forming copper interconnections using electrochemical plating processes

Application: 11/027,514 →

Publication: US 2005/0153545

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.