Patent Assignment
Reel/Frame 016161/0077
Assignment of Assignor's Interest
Recorded: 2005-01-19
Pages: 3
Assignors
NAITO, HIROYUKI
Executed: 2004-10-21
SHIDA, SATOSHI
Executed: 2004-10-20
HAJI, HIROSHI
Executed: 2004-10-19
MORIKAWA, MAKOTO
Executed: 2004-10-25
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property
(1)
Method for mounting semiconductor chip and semiconductor chip-mounted board
Application:
10/958,246 →
Publication:
US 2005/0110161
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.