Patent Assignment
Reel/Frame 016168/0872
Assignment of Assignor's Interest
Recorded: 2005-06-20
Pages: 4
Assignee
NORTHROP GRUMMAN CORPORATION
21240 BURBANK BOULEVARD, BUILDING 35, WOODLAND HILLS, CALIFORNIA, 91367
Covered Property
(1)
Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in MEMS accelerometers
Application:
60/684,431 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 21, 2006
From: NORTHROP GRUMMAN CORPORATION
To: LITTON SYSTEMS, INC.
Reel/Frame 018148/0388 →
Assignment of Assignor's Interest
Nov 27, 2007
From: ABBINK, HENRY C.; KUHN, GABRIEL M.; GE, HOWARD; SAKAIDA, DARYL
To: NORTHROP GRUMMAN CORPORATION
Reel/Frame 020167/0222 →